How Can Vacuum Technology Improve Your FPCB Cover Lay Application Quality?

Our 150Ton FPCB Vacuum Quick Press achieves superior vacuum levels (20torr in just 3 seconds) that significantly reduce air entrapment during cover lay application. This eliminates common defects like bubbles and delamination while ensuring uniform pressure distribution across the entire board surface. The result is consistently higher yield rates and reduced rework costs compared to conventional pressing methods. Contact us for a technical assessment of how our vacuum technology can improve your specific FPCB manufacturing process.

Featuring a compact footprint of 1550 x 1200 x 1750mm, this vacuum lamination press maximizes operational efficiency while minimizing space requirements. The system delivers consistent temperature control with accuracy of 180°C ± 3.5°C across the effective pressing area of 530 x 550mm. Technical advantages include reduced pressure during processing to eliminate post-press curvature issues, extended auxiliary material lifespan, and minimized imprint problems. With intuitive controls requiring minimal operator training and adjustable pressure up to 50 kg/cm², the VFPC1-15V exemplifies Vigor Machinery's 35-year commitment to developing precision equipment for the electronics manufacturing industry.